Micro and Smart Systems

Total Lectures

40

Mod-01 Lec-01 Glimpses of Microsystems: Scaling Effects

Lectures

Mod-01 Lec-01 Glimpses of Microsystems: Scaling Effects
Mod-01 Lec-02 Smart Materials and Systems
Mod-01 Lec-03 Microsensors
Mod-01 Lec-04 Microactuators
Mod-01 Lec-05 Microsystems: some Examples
Mod-01 Lec-06 Smart systems Application and Structural Health Monitoring
Mod-02 Lec-07 Microfabrication Technologies
Mod-02 Lec-08 Thin-film Materials and their Deposition
Mod-02 Lec-09 Approaches for Pattern Transfer
Mod-02 Lec-10 Surface Micromachining of Microstructures
Mod-02 Lec-11 Bulk Micromachining of Microsystems
Mod-02 Lec-12 Extended Approaches for Working Microsystems
Mod-02 Lec-13 Non-conventional Approaches for Microsystems
Mod-02 Lec-14 Packaging of Microsystems
Mod-03 Lec-15 Deformation Strains and Stresses
Mod-03 Lec-16 Microdevice Suspensions: Lumped Modeling
Mod-03 Lec-17 Residual Stress and Stress Gradients
Mod-03 Lec-18 Torsion and Twist
Mod-03 Lec-19 Vibrations of Microsystems Devices: Part -1
Mod-03 Lec-20 Vibrations of Microsystems Devices: Part -2 Micromachined Gyroscopes: Part -1
Mod-03 Lec-21 Micromachined Gyroscopes: Part -2 Modelling of Coupled Electrostatic
Mod-03 Lec-22 Modelling of Coupled Electrostatic Microsystems: Part -2
Mod-03 Lec-23 Coupled Electrothermal-elastic Modelling
Mod-03 Lec-24 Modelling of Microsystems: Scaling Effects
Mod-04 Lec-25 Finite Element Method and Microsystems
Mod-04 Lec-26 Theoretical Basis for the Finite Element Method
Mod-04 Lec-27 Energy Theorems and Weak Form of the Governing Equation
Mod-04 Lec-28 Finite Element Equation Development and Shape Functions
Mod-04 Lec-29 Isoparametric FE Formulation and some Examples
Mod-04 Lec-30 Finite Element for Structures with Piezoelectric Material
Mod-05 Lec-31 Semiconductor Device Physics
Mod-05 Lec-32 BJT and MOSFET Characteristics and Op-Amps
Mod-05 Lec-33 Op-Amp Circuits and Signal conditioning for Microsystems Devices
Mod-05 Lec-34 Control and Microsystems
Mod-05 Lec-35 Vibration Control of a Beam
Mod-05 Lec-36 Signal Conditioning Circuits and Integration of Microsystems and Microelectronics
Mod-05 Lec-37 Pressure Sensor Design Concepts, Processing, and Packaging: Part -1
Mod-05 Lec-38 Pressure Sensor Design Concepts, Processing, and Packaging: Part -2
Mod-05 Lec-39 Pressure Sensor Design Concepts, Processing, and Packaging: Part -3
Mod-05 Lec-40 Capacitive Micro-accelerometer: Part -2
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